Teknik Bilgiler

Base material type

Type PCBs	Material	Thickness in  mm
Singlesided	FR4	0.4 ; 0.6 ; 0.8 ; 1.0 ; 1.2 ; 1.55 ; 2.0; 2.4; 3.0; 3.2
Doublesided	FR4	0.4 ; 0.6 ; 0.8 ; 1.0 ; 1.2 ; 1.55 ; 2.0; 2.4; 3.0; 3.2
Material for multi-layer PCB	FR4 ML	0.46; 0.61 ; 0.76
Singlesided on aluminium base	IMS HA50	1.55

Production capabilities

Maximum dimensions of PCB:	368 x 518 mm, ML 236 x 396 mm
Maximum thickness of PCB:	3,2 mm
Minimum thickess of PCB:	0,4 mm
Minimum drilled hole:	Ø 0,3 mm ; final plated throught hole Ø 0,2 mm
Aspect ratio:	1:5
Toleranc of plated throught holes:	to Ø ? 2,0 mm: +/- 0,1 mm
	2.0 mm < Ø ? 5.3 mm: +/- 0,15 mm
	up to Ø 5,3 mm: +/- 0,2 mm
Maximum layers:	8

Conductor width (conductive pattern on outer layer of PCB)

Cooper thickness	Min.conductor width	Min. annular ring	Final conductor tolerance
/µm/	/mm/	/mm/	/mm/
18	0.15	0.15	+ 0.02 - 0.05
35	0.20	0.20	+ 0.03 - 0.08
70	0.30	0.30	+ 0.03 - 0.12

Conductor spacing (conductive pattern on outer layer)

Cooper thickness	Minimum distance between conductors	Final tolerance of distance between conductors
/µm/	/mm/	/mm/
18	0.15	+ 0.05 - 0.02
35	0.20	+ 0.08 - 0.02
70	0.25	+ 0.12 - 0.03

Inner layer (Inner layer plating : Cu 35/35)

	Minimum /mm
Distance between conductors:	0.20
Conductor width:	0.20
Annular ring:	0.23
Annular clearance PAD - Cu:	0.20
Annular clearance Drill - Cu:	0.40

Surface treatment

	Thickness
Hal PB free:	2 - 40 µm
Immersion tin:	0.8 - 1.2 µm
Chemical Ni/Au:	Ni- 5µm / Au - 0.1 µm

Solder mask

Addition to diameter of soldering pad:	0.10 mm
Addition to diameter of SMD pad:	0.10 mm
Min. width solder resist:	0.15 mm
Color	standard - green
	others - black, red, blue, white

Screen-printed legend

Minimum line width:	0.12 mm
Minimal font height:	1.5 mm

Peelable protective mask

Hole covering:	Maximum diameter: 2.0 mm
Solder pad covering:	≥ 0.4 mm Addition to soldering pad diammeter
Distance between protective mask and pad:	≥ 0.6 mm
Distance between prot. mask and PCB edg:	≥ 0.6 mm

Carbon print

Conductor width:	Minimum 0.4 mm
Clearance width (isolation gap)	Minimum 0.4 mm
Contact pad coverage:	Minimum 0.1 mm (addition to the pad edge)

Final treatment

Routing:	tol. +/-0,2 mm
V - cutting:	tol. +/-0,2 mm

 

Bilgilerinizi gönderdikten sonra, en kısa süre içerisinde talepleriniz için sizinle iletişime geçilecektir.